The Union Cabinet, chaired by Prime Minister Narendra Modi, has approved the setup of two semiconductor manufacturing units in Bhubaneswar, Odisha. This landmark decision is part of a larger approval of four semiconductor projects across Odisha, Andhra Pradesh, and Punjab, with a cumulative investment of Rs 4,600 crore.
Key Highlights of the Approved Projects in Odisha
- SiCSem Pvt Ltd: In collaboration with UK-based Clas-SiC Wafer Fab Ltd, this unit will establish India's first commercial silicon carbide (SiC) semiconductor fabrication facility in Info Valley, Bhubaneswar. It will have an annual capacity of 60,000 wafers and a packaging output of 96 million units.
- 3D Glass Solutions Inc.: This project will focus on advanced packaging and embedded glass substrate manufacturing, utilizing cutting-edge technologies like glass interposers and 3D heterogeneous integration modules. The facility will produce 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules annually.
Impact and Significance
- These projects will position Odisha as a significant player in India's growing semiconductor ecosystem.
- The units are expected to generate over 2,000 skilled jobs and boost local supply chains.
- Chief Minister Mohan Charan Majhi has expressed gratitude to the Central Government, highlighting the collaborative effort's potential to accelerate innovation, create jobs, and strengthen Odisha's contribution to India's vision.
With this approval, the total number of semiconductor projects under the India Semiconductor Mission reaches 10, with cumulative investments of about Rs 1.60 lakh crore across six states.